FWIW... I Copy-Pasted your entire Post #1 and dropped it over on my Off Line
(NO INTERNET CONNECTION ) Nomic *GPT4ALL* LLM AI (Large Language Model) using the Llama 3.1 8 Billion Token Model with the 128KB Prompt Window. THIS is what *IT* suggested investigating:
Nomic *GPT4ALL* is completely FREE to Download, Install on Windows, MAC and Linux Operating Systems and Use in complete Off Line Privacy. This "Oracle at Delphi" may prove very useful to you in the future.
Grab it and Save it...while you still can:
Please note that any time Aging Instrument Panel Clusters are involved and they were assembled using Non-Lead (pB) Solder and the element Tin dominates in the solder alloy... over time "Tin Whiskers" 1,000 Xs smaller than a Human Hair... will Grow like a Beard...
even with Brand New In Box Modules (BNIB) that are just sitting around on Store Shelves!
These "Tin Whiskers" are HIGHLY CONDUCTIVE AND VERY FLEXIBLE and can propagate in between various points on the Circuit or Logic-Mother Board and allow Electricity to go where it should not be making contacts... evincing weird Module Behavior
(See the NASA Power Point linked below covering this issue with an APP Sensor Gas Pedal Module that can lead to accidental WOT Events) and even cause a serious and hard to diagnose Parasitic Drain (Draw) and become a "Battery Killer".





PS... Since
@TJBaker57 has done extensive Bench Top Tear-downs of various Modules to edify us on their Electro-Mechanical Properties and FUBAR issues involving IPC and IGN Modules... the attached NASA Report (NASA's Metal Whisker Group) they conducted in this PDF at the request of the NHTSA regarding a "Dangerous APP Module" might prove very interesting to his investigations as well:
A Random Incident Video involving this phenomena...
Just my
